Yield Improvement in Wave Soldering Process by Using Customised Pallets

Presently there are two types of components available in the Electronic Industries; they are 1. Surface-mounted Devices 2. Leaded components (through-hole components). Surface-mounted components can be assembled at first speed due to automation in the mounting and reflow soldering process. But the speed at which leaded components are mounted and soldered is not that fast. Hence there is always a challenge to match the production rate of PCB having led and surface mounted devices.